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Investigation and Simulation of Biodegradation Suppression in Electroless Nickel Plating Baths
| Authors: Vinokurov E.G., Skichko A.S., Mukhametova G.M., Kozhukhar O.Yu., Burukhina T.F., Meshalkin V.P. | Published: 09.08.2020 |
| Published in issue: #4(91)/2020 | |
| DOI: 10.18698/1812-3368-2020-4-103-122 | |
| Category: Chemistry | Chapter: Physical Chemistry | |
| Keywords: bath biodegradation, electroplating, growth inhibition, kinetic parameters, filamentous fungi, simulation, Verhulst model, fungicides, electroless nickel plating | |